Electronic device design and production processes are experiencing an evolution. Devices are becoming increasingly more complex and smaller in size, with trends in functionalities and aesthetics supported by innovations in adhesive bonding technology.
Adhesives not only facilitate miniaturization but also increase performance and improve smart device functionality and reliability. Among the emerging adhesive technologies gaining traction is Low Pressure Moulding (LPM) technology and the use of Thermal Interface Materials (TIM).
LPM is a cross between classic plastic injection and resin potting. Simplified to a single, fast process, LPM solutions are multipurpose, resistant towards high temperature and oil. It also provides easy processability at low pressures and low temperatures. Given the low injection pressure of LPM solutions, it requires less equipment and consumes less energy. The reduced cycle times with one component products also allows immediate setting with no mixing errors.
LPM solutions’ delicate encapsulation proves suitable for use with the most sensitive of electronic components. Its watertight capabilities and resistance to high temperatures, shocks, harsh environments, and solvents make it ideal in protecting and sealing components like connectors, onboard electronics, LEDs and printed circuit boards (PCBs) against moisture, dust and dirt. LPM solutions’ lightweight and sky-lining design with no housing needed assures manufacturers of its contribution toward the aesthetics of their products.
Sustainability is not only a modern buzzword but is now very much a requirement in the manufacturing process. LPM solutions are solvent-free, bio-based up to 80 percent, and contributes to zero waste due to its recyclable excess material and long shelf life with improved end-of-life management.
Meanwhile, the use of TIM is an elegant solution to alleviate heat dissipation in electronics. As devices are scaled smaller, heat sinking elements become too bulky for use in these devices. Thermal gap-fillers bond a heatsink to a hot component, efficiently transferring heat away from a set of hot components.
As a key industry leader, Bostik works closely with equipment manufacturers and low pressure injection experts to innovate, create and offer the best solution for every encapsulation project, like the Thermelt Polyamide Hot Melts range. Bostik LPM adhesives are high performing, safe and non-toxic sustainable solutions made with environmentally friendly materials. It is also moldable with good adhesion at a fast cycle of 90 seconds.
Bostik is always looking to offer viable products to their partners in the electronic market. Thus, the recent acquisition of Polytec PT GmbH is a move towards becoming a full system provider with specialty adhesives and thermal interface materials for applications in the electronics sector.
